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      Capabilities

      CapabilityDetails
      Materials FR-1, FR-4, CEM-1, CEM-3, Al-based, Ceramic-based
      Layer Coverage Single Sided, Double Sided, 4/L - 16/L Multi
      Board Thickness 0.4mm-3.2mm
      Copper Cladding 1/3oz-12oz (Inner), 1/3oz-6oz (Outer)
      Minimum Trace 0.1/0.1mm(min) (Width/Spacing)
      Min. Hole Size 0.2mm finished mechanical
      Hole Size Tolerance +/-0.075mm (PTH), +/-0.05mm (NPTH),+/-0.10mm(SLOT)
      Aspect Ratio Visa < 12:1
      Surface Treatment HAL, HAL Lead Free, Immersion Silver, Immersion Gold, OSP
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